Tungsten-copper products primarily consist of tungsten and copper, with a copper content of 20±1%, a density ≥15.40 g/cm³, and a uniform appearance free of defects such as pores or cracks. They exhibit an airtightness of ≤1×10⁻⁹ Pa·m³/s, thermal conductivity of 206 W/m·K, and a thermal expansion coefficient of 7.7 ppm/℃, offering excellent overall performance and compatibility with chip materials. Utilizing injection molding technology, complex shapes can be directly produced, significantly reducing machining requirements, conserving raw materials, and lowering production costs. Suitable for thermal management needs across multiple fields including optical modules, aerospace, and military applications, market demand is robust. Complex-shaped products yield higher profit margins, and core technologies are protected by proprietary intellectual property rights.