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Spherical copper powder is characterized by high purity, low oxygen content, high sphericity, smooth surface, no satellites, uniform particle size distribution, excellent flow properties, high bulk density and high vibration density.
Item No :
Spherical Cu PowderOrder(MOQ) :
1kgProduct Origin :
Foshan City, Guangdong ProvinceLead Time :
3-7 days for spot goods; customized delivery time negotiated by both parties.Powder properties
Morphology: Good sphericity, most particles are relatively regular spherical, the surface is relatively smooth, reducing the agglomeration of particles, which is conducive to uniform dispersion in various media.
Particle size: The particle size distribution can be adjusted according to the preparation process, covering a wide range, ranging from submicron to tens of microns, and can achieve a narrow particle size distribution to meet the particle size requirements of different applications.
Purity: Through appropriate preparation methods, high-purity spherical copper powder can be obtained, and the content of impurities (such as iron, zinc, lead, etc.) is low, ensuring its good electrical conductivity, thermal conductivity and other properties.
Density: The loose density and tap density are moderate, and it has a certain degree of compactness when stacked, providing basic conditions for subsequent molding processing.
Activity: It has a certain chemical activity and can participate in the reaction or combination well in specific chemical reactions or when compounded with other materials.
Application field
Electronic field: used to make electronic paste, such as in the manufacture of printed circuit boards (PCBs), as a material for conductive lines; it can also be used to manufacture electrodes for electronic components, taking advantage of its good conductivity.
Powder metallurgy: As a raw material for preparing copper-based alloys and copper-containing parts, various mechanical parts, bearings, gears, etc. are manufactured through mixing, pressing, sintering and other processes with other metal powders to improve their strength and wear resistance.
Thermal spraying: A copper coating is formed on the metal surface through thermal spraying technology to improve the wear resistance, corrosion resistance and conductivity of the substrate, and is used for mechanical repair and surface protection.
3D printing: As a metal 3D printing material, copper products with complex structures can be manufactured to meet the needs of personalization and customization.
Chemical catalyst: Used as a catalyst or catalyst carrier in some chemical reactions to promote chemical reactions.
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