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Spherical tungsten-molybdenum alloy powder 45-105μm

Spherical tungsten-molybdenum alloy powder 45-105μm

Spherical tungsten-molybdenum alloy powder is an alloy powder with spherical morphology prepared by a special process based on two refractory metals, tungsten (W) and molybdenum (Mo). This alloy powder combines the high melting point and high hardness of tungsten with the excellent thermal conductivity and thermal fatigue resistance of molybdenum. Meanwhile, it demonstrates unique advantages in fields such as electronic information, aerospace, and high-temperature metallurgy due to its spherical structure, making it a key material for promoting the development of high-end manufacturing.

  • Item No :

    Spherical tungsten-molybdenum alloy powder 45-105μm
  • Order(MOQ) :

    1 Kg
  • Product Origin :

    Foshan City, Guangdong Province
  • Lead Time :

    3-7 days for spot goods; customized delivery time negotiated by both parties.
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Spherical tungsten-molybdenum alloy powder

I. Characteristics

1.Physical properties: Spherical tungsten-molybdenum alloy powder has an extremely high melting point, typically between 2600 and 2800℃, far exceeding that of most metals and alloy materials. It can withstand extreme high-temperature environments without melting or deforming.

2. Mechanical properties: Materials prepared from this alloy powder exhibit excellent mechanical properties. At room temperature, the tensile strength can reach 1500-2000 mpa, the hardness (HV) exceeds 400, and it has excellent wear resistance and anti-deformation ability.

3. Chemical properties: Spherical tungsten-molybdenum alloy powder has stable chemical properties and is not prone to react with water or most acids and bases at normal temperature.

Ii. Application Fields

1.In the field of electronic information: Due to its high thermal conductivity, low coefficient of expansion and good chemical stability, spherical tungsten-molybdenum alloy powder is often used to prepare high-performance electronic packaging substrates and heat sink materials. As sputtering targets and high-temperature diffusion sources in the semiconductor chip manufacturing process.

2. Aerospace field: It is used to manufacture hot-end components such as combustion chambers, turbine blades, and guide vanes for aero engines, as well as high-temperature load-bearing structural parts for aircraft.

3. Energy field: In nuclear reactors, it can be used as a material for fuel cladding, control rods, and core structural components, and is applied to high-temperature heat collection tubes, heat exchangers, and other components in solar thermal power generation systems.

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